Since 2005, Taiwan Conference on Software Engineering (TCSE) provides a forum where researchers, educators, and practitioners exchange their research results in the field of software engineering. This special issue is meant primarily to contain selected papers presented at the 19th Taiwan Conference on Software Engineering (TCSE 2023), for which the theme is “Software Engineering and Medical Informatics,” to be held in Hualien City, Taiwan. Medical informatics is a cross-domain subject that explores the application of information and communication technology and software engineering methodology in the medical field, including medical diagnosis and treatment, health care, medical information standards, biological information processing, long-term care, etc. Software technologies are undoubtedly critical for developing high-quality systems in a variety of fields (e.g., education, financial technology, digital transformation, digitization and translation of ancient classics, technological art, and social communication). Thus, in addition to medical informatics, we encourage submissions on presenting and discussing the most recent innovations, trends, experiences, and concerns in various cross-domain software development and application technologies. It is noted that this special issue is also open to submission of papers from other authors although the enhanced version of selected TCSE 2023 papers will be its primary source. Major topics of interest are listed but not limited to the following:
Interdisciplinary technologies/ applications for software engineering
Software engineering for hospital/ healthcare
Health information system development
Fintech software development
Artificial intelligence application on software engineering
Ubiquitous/pervasive software systems
Security, privacy and trust
Software engineering for IoT
Cyber physical systems
Green and sustainable technologies
Model-driven engineering
Software engineering education
The submissions should follow the formatting guidelines of the Journal of Information Science and Engineering (https://jise.iis.sinica.edu.tw/pages/authors/index.html). Any questions regarding this special issue should be sent to the guest editors. All submitted papers will be reviewed by at least three reviewers and selected based on their originality, significance, relevance, and clarity of presentation. The manuscript should be prepared in JISE Word (or Latex) standard and converted into a PDF for auto-submission system. Electronic paper should be submitted to SI_Auto_Submit_System at https://journal.iis.sinica.edu.tw/surl/jise-23tse
Manuscript Submission Deadline: September 30, 2023
Authors Notification Date: March 31, 2024
Camera-ready Deadline: April 30, 2024
Tentative Publication Date: September, 2024
Yu Chin Cheng
National Taipei University of Technology, Taiwan
E-mail: yccheng@ntut.edu.tw
Hidehiko Masuhara
Tokyo Institute of Technology, Japan
E-mail: masuhara@acm.org
Chien-Hung Liu
National Taipei University of Technology, Taiwan
E-mail: cliu@ntut.edu.tw
Jiann-I Pan
Tzu-Chi University, Taiwan
E-mail: jipan@mail.tcu.edu.tw
Chu-Ti Lin
National Chiayi University, Taiwan
E-mail: chutilin@mail.ncyu.edu.tw